News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Interview
03 August 2026

Africa export finance fires on all cylinders with Citi’s...

Richard Hodder, head of export finance at Citi, outlines Citi’s Africa export finance strategy, discusses the evolution of ECA shopping lines in Europe and changes at US Exim....

Perspective
07 August 2026

Asia export finance: More grey than green

Asia’s export finance market is open and institutionally committed — but quieter on volume, stricter on content, and leaning on LNG and strategic supply chains rather than a...