News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Perspective
27 November 2025

TXF Dealmakers 2025: Top takeaways

The main themes - including decarbonisation and political volatility - have been echoed in TXF’s earlier events. But the sense of urgency about transformations to economies...

Perspective
01 December 2025

A benchmark in ECA shopping line credits

Euler Hermes’ inaugural shopping line credit under the German government’s new framework heralds a new era in German export finance. The bespoke solution — originated,...