News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Perspective
05 May 2026

Glencore scales new peaks with Project Matterhorn

Glencore has entered the securitisation market for the first time with an industry-leading receivables transaction. The challenges involved were significant, even for a...

Video
05 May 2026

Trade waits for no-one: Nexent Bank on navigating volatility

Selim Caydamli, global head of structured trade & commodity finance at Nexent Bank, joins the TXF In-Depth podcast to discuss geopolitical turmoil and the importance of...