News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Video
08 June 2026

Behringer at Siemens FS retains his zeal for sustainable...

Tobias Behringer, head of financial advisory at Siemens Financial Services discusses how the financing arm is retaining the momentum for transition financing at lill Global...

Perspective
11 June 2026

Taking the temperature on the ECA pipeline

Will ECAs be able to sustain the bumper volumes of recent years in 2026? Expect a dip as financial institutions build their pipelines once again. Yet ECAs are determined to...