News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Perspective
04 June 2026

A boom in sustainable export finance - on a smaller base

TXF Intelligence’s sixth Sustainability in Export Finance Data Report shows sustainable export finance reached its highest recorded volume in 2025. But those figures came from...

Perspective
11 June 2026

Taking the temperature on the ECA pipeline

Will ECAs be able to sustain the bumper volumes of recent years in 2026? Expect a dip as financial institutions build their pipelines once again. Yet ECAs are determined to...