News
20 December 2022

Brookfield and Intel close semiconductor manufacturing loan

In:
Manufacturing & equipment
Region:
Americas

Brookfield and Intel have closed on a $14.25 billion project financing for the funding of two semiconductor fabrication facilities in the US.This transaction represents the largest infrastructure loan ever in North America and is this first-of-its-kind semiconductor co-investment program introduces...

Exclusive subscriber content…

If you are a TXF subscriber, please login to continue reading

Login

Not yet a subscriber? Join us today to continue accessing content without any restrictions

View our subscription options

Or to request access to TXF Intelligence contact us

Request Access

You might also like


Perspective
15 July 2026

KBU: A lesson in long ECA tenors in Africa

Long tenors remain the scarce commodity in Sub-Saharan social infrastructure. But Mitrelli has reached financial close on a 19-year Atradius-backed loan for the Katyavala...

Perspective
24 July 2026

ME: When ECAs hit the country ceiling

Fragmented Gulf procurement, tighter local liquidity, strained country limits and Saudi-scale ambition are forcing ECAs beyond the classic tied facility. Shopping lines,...